Finite Element Analysis (FEA)

Let TTCI perform an analysis of stress, strain, and flex induced on the printed circuit board assembly by the test fixture to validate fixture design before exposing the board to potentially damaging forces.

The model of the board under test uses your fixture data, accurately placing board supports, push fingers, and probe forces. Features specific to the fixture actuation method, such as perimeter gaskets and vacuum pressure are also modeled. Our analysis will allow you to optimize the test fixture design before it is built, while supporting the most aggressive build schedules.